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PCB Design and IoT Training

We provide the best PCB design and IoT based Products Design Training

PCB Design Training

3W Technologies. Now offers on-site/offshore training No need to send your employees out for training, we will come to you and provide training at your place. We will provide crash course for the Electronics and electrical Students as part of their projects.Courses will be done with the below steps

Module 1 :
Pre Layout Setup Setup the PCB layout in Mentor Graphics pads [v9.3 and v9.5] software, fixing the layer setup, grid configuration and backup folder making.

Module 2 :
Footprint Creation
- Component Boundaries, Pad Sizes, Outlines Measuring pitch and diameter with vernier, grid setup, data sheet measurement, IPC2221 standard foot print creation, LP wizard foot print making.

Module 3 :
Schematic DRC Setup schematic in ORCAD software, backup setting, location folder setting, schematic page setup, documentation, title date setup, Library setup.

Module 4 :
Net list Generation Schematic Generate Net list for the suitable PCB software, file format checking, error file checking, net to net checking, .asc file reading.

Module 5 :
Drawing schematic Schematics drawing in ORCAD software, library making. New part making, library importing, connection. Net name conversion and connection. Generating BOM. Generating NET List.EDF file making.

Module 6 :
Initial Design Setup Initialization the total project. Setup Schematic software PCB software and Garber software. Set up file and folder path.

Module 7 :
Netlist Import PCB Importing Netlist in PADS PCB software.net checking. Error and solution.

Module 8 :
Board Outline DXF Import Board outline fixing . mounting hole fixing. Board cutout fixing. Round shape PCB cutout, DXF AutoCAD file importing. Selecting Lear definition. Thermal area fixing.

Module 9 :
Substrate Selection: Selection of material. Selection of copper thickness. Selection of board thickness. Selection of board material thickness. Knowledge of different PCB material.

Module 10 :
Copper Weight Selection Selection of copper width. Current flow and copper width relation. Heat and thermal copper area selection. Material to copper life calculation with respect to power and Heat.

Module 11 :
Surface Finish Selection, Surface buffing limit. Etching process limits. Silkscreen material selection. Screen printing material selection. Rustproof plating material selection.

Module 12 :
Layer Stack up Selection Layer stack up selection for double side or multi Layer PCB design. Single side PCB drill hole selection. Single side PCB pad size selection with respect to the Standard.

Module 13 :
Impedance Control & Trace Widths High speed bus selection. High speed PCB Layer flow. Impedance matching. TX RX line design for MUC. High speed signaling for BGA component.

Module 14 :
Title Block & Notes Tile block mounting. Documentation. And DFM note creation.

Module 15 :
Design Rules Setup: Setup trace to trace gap. Trace to pad gap. Copper gap. Board to Trace gap. Component placement rules set up. Trace with the selection set up. Component height and board width selection.

Module 16 :
Placement: Placement of the component. Mounting hole. Component side and solder side selection. Placement standards, maintain. High speed routing placement. DFA standard maintain.

Module 17:
Critical Parts Placement Complex PCB design. Small size PCB designs with complex part.

Module 18:
Signal Flow Understanding the signal flow. Understanding input and output. Input output placement depending upon the potential difference. Analog and digital signal separation.

Module 19 :
Analog Placement ADC placement. POT placement. OP-AMP placement. Power chip placement. Mosfet placement and tracing. Potential barrier design. Potential guard design. Analog ground separation.

Module 20 :
Digital Placement MUC placement . BGA component placement and routing . digital ground pouring. Digital signal bus placement.

Module 21 :
RF Placement RF signal integrity . RF component placement. RF ground pouring. RF Antenna design.

Module 22:
Decoupling Caps Decoupling capacitor placement . MUC Clock speed maintain. MUC reset cycle maintain.

Module 23 :
Termination Devices

Module 24 :
Rework Considerations

Module 25 :
Soldering Considerations

Module 23 :
Testpoint Considerations

Module 24 :
Fiducials 

Module 25 :
Routing Power trace design. signal trace design. Heat sink area design. Layer via design. Trace necking . DFM setup. High frequency bus separation . Via reduction planning. Power via ,Micro via , Signal via placing.

Module 23 :
Vias - STD, Blind, Buried, Micros 

Module 24 :
General Routing Techniques

Module 25 :
Bus Routing Matched Lengths 
Module 26 :
Plane Setup & Splits
Module 27 :
RF Corners

Module 28 :
Differential routing
Module 29 :
Guard Rings
Module 30 :
High Voltage
Module 31 :
Test points

Module 32 :
Checklist Logos, Markings, Notes
Module 33 :
Gerber Setup
Module 34 :
Fabrication Drawing
Module 33 :
Assembly Drawing
Module 34 :
Panel Drawing 

IoT Products Design Trainings

3W Technologies. Now offers on-site/offshore training No need to send your employees out for training, we will come to you and provide training at your place. We will provide crash course for the Electronics and electrical Students as part of their projects. Courses will be done with the below steps

Components
Selection

In this phase we will guide you how to think about an IoT project and how to choose the best components for the same.

Datasheet
Study

In this phase we will guide you how to study a datasheet. What are part of a datasheet are most important depend upon the component.

Online
FAQ

In this phase you will understand about the self study and confident build up

Module
Testing

After FAQs we will understand the complexity of the project and we will test it module by module.

Understanding
Project IO's

In this phase we will understand how to calculate IO's of a device and depend on that best part choosing.

Power Distribution Planning

In this Phase we will understand how to calculate the power distribution and consumption of the device. Depend on that we will choose the power input.

Understanding
Use

Here we will try to understand how and where the device will be use. What will the burning hours every day? Also we will understand the maximum effect of environment on the device and precautions.

Minimum Life
Calculation

In this phase we will try to calculate the minimum working life of the device and the effect on the environment.

Component Availability

In this phase we will understand how the find out the proper resources of all the required component and availability.

library
collection

In this phase we understand about all the using sensors, best platform for the programming and prototyping, the available library and how to use it.

Frame
Design

Here we will understand what is the frame design? Why it required? How to use it?

Fitting
Design

Here we will understand what should be the fittings for the device. And how the get it done or make it.

PCB Design

In this phase we will learn the PCB design and required layer for the design and how to make the production data.

Assembling

In this phase we will learn how to assemble the products? Soldering, and dry soldering. 

Programming

Here we will understand the programming, Uploading HEX Code,
and production hex code or bin file making. Android app development is also included if anybody wants to learn.  

Testing

Here we will understand all kind of testing and how to do it?

Parameter Test

Here we will try to understand more about the entire required parameter test and how to do it.

Bench Testing

Here we will do the bench test with the application and we will update the device in all the aspect until it reach to the satisfaction.

Burn Testing

Here we will understand how to do field testing and record data for the test report.

Documentation

This is one of the most important parts of any projects. Here we will try to understand why and how to do it?

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Choose from the large selection pre-made blocks - full-screen intro, bootstrap carousel, slider, responsive image gallery with, parallax scrolling, sticky header and more.

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